Research Data Archive
AP210 Research Data Archive
Comprehensive, citable research datasets for ISO 10303-210 (AP210) Electronic Assembly, Interconnect and Packaging Design applications.
About This Archive
This archive provides complete, downloadable datasets from collaborative research between NIST (National Institute of Standards and Technology) and PDES Inc. All data is released under Creative Commons Attribution 4.0 International License (CC-BY 4.0) for maximum research accessibility.
Available Research Datasets
NIST Research Projects
NIST AP210 CFD Project
Computational Fluid Dynamics analysis data and models for electronic assembly thermal management.
Project Details • Download Data
NIST AP210 GDT Projects
Geometric Dimensioning & Tolerancing data for electronic connectors and IC packages.
Connectors Project • Packages Project • Download Data
NIST AP210 SPICE Project
Integration of SPICE circuit simulation data with AP210 electronic assembly design data.
Project Details • Download Data
PDES Inc. Projects
PDES AP210 Viewer Project
Visualization and viewing tool data for AP210 electronic assembly designs.
Project Details • Download Data
PDES IDF to AP210 Project
Intermediate Data Format (IDF) to AP210 conversion project data and tools.
Project Details • Download Data
How to Cite
When using data from this archive, please cite:
NIST, PDES Inc. AP210 Research Data Archive.
https://github.com/expresslang/ap210-research-data
DOI: https://doi.org/10.5281/zenodo.16496290
Individual project citations are available on each dataset’s page.
Data Formats
- AP210 STEP files (.stp, .210) - ISO 10303-210 electronic assembly data
- IDF files (.idf, .brd, .lib) - Legacy PCB design format
- SPICE files (.cir, .sp) - Circuit simulation netlists
- Documentation - Technical specifications and methodologies
License
All datasets are released under Creative Commons Attribution 4.0 International License (CC-BY 4.0), allowing maximum reuse with proper attribution.
This research data archive supports advancing the state of electronic design automation and standards-based data exchange in the electronics industry.