Skip to content

Scope

AP 210 defines an application protocol within the STEP (ISO 10303) framework for the representation and exchange of data related to the design of electronic assemblies and their interconnect substrates.

In Scope

AP 210 covers the following aspects of electronic design:

Product Definition

  • Component and assembly classification

  • Physical and functional product structures

  • Bill of materials and product variants

Physical Design

  • Printed circuit board (PCB) layout geometry

  • Component placement and orientation (including transformation matrices)

  • Layer stack definitions with stratum technology

  • Land patterns and footprints for surface mount and through-hole components

  • Routing and trace geometry

  • Via structures (through, blind, buried)

Connectivity

  • Logical net definitions

  • Physical interconnect routing

  • Interfacial connections between components and substrates

  • Signal integrity constraints

Design Rules and Constraints

  • Manufacturing design rules (clearances, spacing)

  • Electrical constraints (impedance, current capacity)

  • Physical requirements (keepout areas, thermal zones)

  • Envelope and boundary constraints

Library and Catalogue

  • Component library definitions

  • Package and footprint libraries

  • Material properties and characterization data

  • Supplier catalogue data

Requirements Capture

  • Functional requirements and design intent

  • Parameter representation (electrical, thermal, mechanical)

  • Design-to-usage view mapping

Out of Scope

AP 210 does not cover:

  • Circuit simulation and analysis (covered by other standards such as SPICE interchange formats)

  • Mechanical CAD modeling of enclosures (covered by ISO 10303-203/AP 203 and AP 214)

  • Manufacturing process planning (covered by ISO 10303-224)

  • Schematic capture and logical circuit design (addressed by ISO 10303-210 at the connectivity level, not at the schematic symbol level)

Relationship to Other STEP APs

AP 210 is one of many application protocols within ISO 10303. It shares common resources with:

  • AP 203/214 — Mechanical design (parts, assemblies, tolerances)

  • AP 224 — Process planning for machining

  • AP 238 — Computer numerical controllers (STEP-NC)

Data exchange between AP 210 and other APs is supported through STEP’s modular architecture using shared Application Modules (ARM) and common Integrated Resources (IR).