Standards
AP 210 has been published as ISO 10303-210 — an international standard within the STEP (ISO 10303) family for electronic assembly, interconnect, and packaging design data exchange.
The standard has evolved through four editions, each expanding scope and refining the information model to address industry needs.
Editions
| Edition | Published | Scope |
|---|---|---|
2004 | Initial scope: printed circuit assembly design data | |
2011 | Expanded to include advanced packaging and interconnect | |
2016 | Added design rules, constraints, and layer stack modeling | |
2021 | Current edition: comprehensive coverage of electronic design data |
Related Standards
AP 210 is part of the STEP (Standard for the Exchange of Product Model Data) family of standards, formally known as ISO 10303. It defines an Application Protocol (AP) that specifies how to represent and exchange data for the domain of electronic assembly, interconnect, and packaging design.