Edition 2 — ISO 10303-210:2011
Second edition of the AP 210 standard for electronic assembly, interconnect, and packaging design.
Publication
ISO reference: ISO 10303-210:2011
Published: 2011
Status: Withdrawn (superseded by Edition 3)
Scope
Edition 2 expanded the scope to address advanced packaging technologies and interconnect modeling. Key additions included:
Enhanced component library definitions with detailed packaging
Advanced interconnect substrate modeling (layer stacks, via structures)
Thermal and electrical properties
Improved physical layout representation
Land pattern and footprint definitions for advanced packaging (BGA, CSP)
Design view and usage view mapping
This edition reflected the industry’s move toward denser, more complex packaging technologies and the need for richer data exchange.