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Edition 3 — ISO 10303-210:2016

Third edition of the AP 210 standard for electronic assembly, interconnect, and packaging design.

Publication

  • ISO reference: ISO 10303-210:2016

  • Published: 2016

  • Status: Withdrawn (superseded by Edition 4)

Scope

Edition 3 significantly expanded the information model with:

  • Design rules and constraints representation

  • Layer stack modeling with stratum technology

  • Physical requirements capture (envelopes, keepouts)

  • Functional product decomposition

  • Interfacial connectivity modeling

  • Parameter representation for electrical and physical properties

This edition introduced the concept of design intent — capturing not just the geometry but the engineering constraints and rules that govern a design. It also aligned more closely with the STEP modular architecture (Application Modules).