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Edition 4 — ISO 10303-210:2021

Fourth and current edition of the AP 210 standard for electronic assembly, interconnect, and packaging design.

Publication

Scope

Edition 4 is the current edition and provides comprehensive coverage of electronic design data exchange. It includes all capabilities from previous editions plus:

  • Full modular architecture aligned with STEP Application Modules

  • Advanced physical requirements and constraints

  • Complete design-through-manufacturing data exchange

  • Material properties and characterization

  • Extended component and package modeling

  • Surface mount and through-hole technology support

  • Multi-layer PCA with complex via structures

This edition represents the most complete standard for electronic design data exchange, supporting the entire lifecycle from conceptual design through manufacturing.

Implementation

The AP 210 project resources include: