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AP210 Overview and Scope

ISO 10303-210 (AP 210) defines the representation and exchange of data for electronic assembly, interconnect, and packaging design.

Scope

AP 210 covers:

  • Electromechanical products in a discrete manufacturing context

  • Design, analysis, and manufacturing planning stages

  • Electrical, mechanical, and systems engineering disciplines

  • Layered interconnect products (PCBs, MCMs, flex circuits)

  • Packaged electronic components (ICs, connectors, passives)

  • Wire harness assemblies

  • Electromechanical equipment enclosures

Key Capabilities

AP 210 supports:

  • Product structure definition and classification

  • Physical shape and layout representation

  • Connectivity modeling (schematic, physical, and layout)

  • Design rule specification and validation

  • Material and property definitions

  • Library and catalogue management

  • Requirements capture and traceability

Relationship to Other APs

AP 210 is unique among STEP application protocols:

  • Superset of AP 242 for electronic design applications

  • Compatible with AP 203/AP 214 for mechanical context

  • Integrates with AP 209 for structural analysis

  • Uses common STEP resources for geometry, materials, and tolerances

Editions

Four editions have been published, each expanding the scope: