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Research Data Archive

Comprehensive, citable research datasets for ISO 10303-210 (AP210) Electronic Assembly, Interconnect and Packaging Design applications.

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About This Archive

This archive provides complete, downloadable datasets from collaborative research between NIST (National Institute of Standards and Technology) and PDES Inc. All data is released under Creative Commons Attribution 4.0 International License (CC-BY 4.0) for maximum research accessibility.

Available Research Datasets

NIST Research Projects

NIST AP210 CFD Project Computational Fluid Dynamics analysis data and models for electronic assembly thermal management. Download Data

NIST AP210 GDT for Connectors and NIST AP210 GDT for Packages Geometric Dimensioning & Tolerancing data for electronic connectors and IC packages. Download Data

NIST AP210 SPICE Project Integration of SPICE circuit simulation data with AP210 electronic assembly design data. Download Data

PDES Inc. Projects

PDES AP210 Viewer Project Visualization and viewing tool data for AP210 electronic assembly designs. Download Data

PDES IDF to AP210 Project Intermediate Data Format (IDF) to AP210 conversion project data and tools. Download Data

How to Cite

When using data from this archive, please cite:

NIST, PDES Inc. AP210 Research Data Archive.
https://github.com/expresslang/ap210-research-data
DOI: https://doi.org/10.5281/zenodo.16496290

Individual project citations are available on each dataset’s page.

Data Formats

  • AP210 STEP files (.stp, .210) - ISO 10303-210 electronic assembly data

  • IDF files (.idf, .brd, .lib) - Legacy PCB design format

  • SPICE files (.cir, .sp) - Circuit simulation netlists

  • Documentation - Technical specifications and methodologies

License

All datasets are released under Creative Commons Attribution 4.0 International License (CC-BY 4.0), allowing maximum reuse with proper attribution.

This research data archive supports advancing the state of electronic design automation and standards-based data exchange in the electronics industry.